Invention Grant
US08148301B2 Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor
有权
用于氧化物超导体的带状基材的研磨方法,氧化物超导体以及氧化物超导体的基材
- Patent Title: Method for polishing tape-shaped substrate for oxide superconductor, oxide superconductor, and base material for oxide superconductor
- Patent Title (中): 用于氧化物超导体的带状基材的研磨方法,氧化物超导体以及氧化物超导体的基材
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Application No.: US12438601Application Date: 2007-08-24
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Publication No.: US08148301B2Publication Date: 2012-04-03
- Inventor: Sanaki Horimoto , Takuya Nagamine , Takehiro Watanabe , Fumi Murokawa , Yuji Horie , Noriyuki Kumasaka , Masahiro Hosoi
- Applicant: Sanaki Horimoto , Takuya Nagamine , Takehiro Watanabe , Fumi Murokawa , Yuji Horie , Noriyuki Kumasaka , Masahiro Hosoi
- Applicant Address: JP Tokyo
- Assignee: NIHON Micro Coating Co., Ltd.
- Current Assignee: NIHON Micro Coating Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Priority: JP2006-229710 20060825
- International Application: PCT/JP2007/066424 WO 20070824
- International Announcement: WO2008/023782 WO 20080228
- Main IPC: H01L39/24
- IPC: H01L39/24

Abstract:
An oxide superconductor member is composed of a tape-shaped substrate, an intermediate layer formed on this substrate and an oxide superconductor thin film layer formed on this intermediate layer. A surface of the tape-shaped substrate is polished by continuously running the tape-shaped substrate. The polishing step includes initial polishing process and finishing process which are carried out such that the average surface roughness Ra of the substrate becomes 2 nanometers or less and the in-plane directionality of the intermediate layer becomes 5° or less after the polishing step.
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