Invention Grant
- Patent Title: Polishing pad and manufacturing method thereof
- Patent Title (中): 抛光垫及其制造方法
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Application No.: US11794284Application Date: 2006-02-27
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Publication No.: US08148441B2Publication Date: 2012-04-03
- Inventor: Masato Doura , Takeshi Fukuda , Kazuyuki Ogawa , Atsushi Kazuno , Hiroshi Seyanagi , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
- Applicant: Masato Doura , Takeshi Fukuda , Kazuyuki Ogawa , Atsushi Kazuno , Hiroshi Seyanagi , Masahiko Nakamori , Takatoshi Yamada , Tetsuo Shimomura
- Applicant Address: JP Osaka-shi
- Assignee: Toyo Tire & Rubber Co., Ltd.
- Current Assignee: Toyo Tire & Rubber Co., Ltd.
- Current Assignee Address: JP Osaka-shi
- Agency: Morrison & Foerster LLP
- Priority: JP2005-063963 20050308; JP2005-081974 20050322; JP2005-081979 20050322; JP2005-163791 20050603
- International Application: PCT/JP2006/303605 WO 20060227
- International Announcement: WO2006/095591 WO 20060914
- Main IPC: C08G18/10
- IPC: C08G18/10

Abstract:
A method for manufacturing a polishing pad made from a polyurethane resin foam having very uniform, fine cells therein and a polishing pad obtained by that method provides a polishing pad having better polishing characteristics (especially, in planarization) while providing improved dressability while maintaining the planarization characteristics and polishing speed of a conventional polishing pad. The polyurethane resin foam is a cured product obtained by reacting an isocyanate-terminated prepolymer with an aromatic polyamine chain extender having a melting point of 70° C. or lower, for example.
Public/Granted literature
- US20080085943A1 Polishing Pad and Manufacturing Method Thereof Public/Granted day:2008-04-10
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