A printed circuit board has a first main side and a second main side disposed opposite the first main side. A first and a second rigid zone are linked to each other by way of a flexible zone and the flexible zone is embodied thinner than the first and second rigid zones perpendicular to the first and second main sides. The flexible zone has at least one metallization layer and at least one substrate layer formed of an insulating material and connected to the at least one metallization layer. The substrate layer is formed with a plurality of trenches which in each case extend at the most up to one of the one or more metallization layers.