Invention Grant
- Patent Title: Flip chip type light-emitting element
- Patent Title (中): 倒装芯片型发光元件
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Application No.: US12222366Application Date: 2008-08-07
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Publication No.: US08148736B2Publication Date: 2012-04-03
- Inventor: Kosuke Yahata , Naoki Nakajo
- Applicant: Kosuke Yahata , Naoki Nakajo
- Applicant Address: JP Aichi-ken
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi-ken
- Agency: McGinn IP Law Group, PLLC
- Priority: JPP.2007-207258 20070808
- Main IPC: H01L27/15
- IPC: H01L27/15

Abstract:
In a flip chip type light-emitting element of the present invention, an n type contact electrode 14 is formed on an n layer 11 exposed in a comb-tooth shape, a light transmission electrode 15 made of an ITO is formed over the entire surface of an upper surface of a p layer 13 and twenty pad electrodes 16 are formed at prescribed intervals on the light transmission electrode 15. The plane form of the pad electrode 16 has four branches 16b protruding in the form of a cross from a circular central part 16a and the adjacent pad electrodes 16 connected to each other by the branches 16b.
Public/Granted literature
- US20090039374A1 Flip chip type light-emitting element Public/Granted day:2009-02-12
Information query
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