Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12719952Application Date: 2010-03-09
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Publication No.: US08148787B2Publication Date: 2012-04-03
- Inventor: Masato Koyama , Akira Nishiyama , Yoshinori Tsuchiya , Reika Ichihara
- Applicant: Masato Koyama , Akira Nishiyama , Yoshinori Tsuchiya , Reika Ichihara
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-059396 20050303
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
There is disclosed a semiconductor device comprising a P-channel MIS transistor which includes an N-type semiconductor layer, a first gate insulating layer formed on the N-type semiconductor layer and containing a carbon compound of a metal, and an N-channel MIS transistor which includes a P-type semiconductor layer, a second gate insulating layer formed on the P-type semiconductor layer, and a second gate electrode formed on the second gate insulating layer.
Public/Granted literature
- US20100155851A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-06-24
Information query
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