Invention Grant
US08148812B2 Thermal resistor, semiconductor device using the same, and electric device
有权
热电阻器,使用其的半导体器件,以及电子器件
- Patent Title: Thermal resistor, semiconductor device using the same, and electric device
- Patent Title (中): 热电阻器,使用其的半导体器件,以及电子器件
-
Application No.: US12303879Application Date: 2007-05-10
-
Publication No.: US08148812B2Publication Date: 2012-04-03
- Inventor: Koji Kise
- Applicant: Koji Kise
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2006-158346 20060607
- International Application: PCT/JP2007/059669 WO 20070510
- International Announcement: WO2007/141987 WO 20071213
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/043

Abstract:
A thermal resistor is a metal body having a contact surface to be partially in contact to form a void and is electrically conductive as a whole. The thermal body may be a layered body having a plurality of metal bodies layered so as to be partially in contact with one another to form a void between them, or a metal body having a plurality of convex and concave portions on the surface, or a metal body formed by a plurality of metal plates each having a plurality of creases and layered so that the creases of the adjacent metal plates intersect, or a layered metal body formed by metal plates each having elasticity in the thickness direction and having elasticity in the layered direction as a whole, or metal body having a film formed by a different metal. Also disclosed in a semiconductor device having the thermal resistor inserted between a heating semiconductor element and a case cover and between a heat spreader and the case cover. Also disclosed is an electric device using the device.
Public/Granted literature
- US20100230804A1 THERMAL RESISTOR, SEMICONDUCTOR DEVICE USING THE SAME, AND ELECTRIC DEVICE Public/Granted day:2010-09-16
Information query
IPC分类: