Invention Grant
US08148819B2 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
有权
半导体装置，半导体装置的安装方法以及半导体装置的安装结构
- Patent Title: Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
- Patent Title (中): 半导体装置，半导体装置的安装方法以及半导体装置的安装结构
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Application No.: US12466681Application Date: 2009-05-15
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Publication No.: US08148819B2Publication Date: 2012-04-03
- Inventor: Yuya Ohnishi
- Applicant: Yuya Ohnishi
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Nixon & Vanderhye, P.C.
- Priority: JP2008-130846 20080519
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor device includes a semiconductor substrate on which an electrode and a Cu bump are stacked. On the electrode and the Cu bump, a metal bump layer is provided. The metal bump layer comprises (i) a solder layer via which the semiconductor device is bonded and electrically connected to the mounting substrate by metal bonding and (ii) a Cu layer. A intermetallic compound can be formed by interdiffusion of the Cu layer and the solder layer.
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Information query
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