Invention Grant
- Patent Title: Integrated circuit package system with leadfinger
- Patent Title (中): 带引线的集成电路封装系统
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Application No.: US12134179Application Date: 2008-06-05
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Publication No.: US08148825B2Publication Date: 2012-04-03
- Inventor: Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Jairus Legaspi Pisigan , Jeffrey D. Punzalan
- Applicant: Zigmund Ramirez Camacho , Lionel Chien Hui Tay , Jairus Legaspi Pisigan , Jeffrey D. Punzalan
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/00
Abstract:
An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.
Public/Granted literature
- US20080303123A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER Public/Granted day:2008-12-11
Information query
IPC分类:
