Invention Grant
US08148831B2 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
有权
环氧树脂潜在催化剂，环氧树脂组合物和半导体装置
- Patent Title: Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
- Patent Title (中): 环氧树脂潜在催化剂，环氧树脂组合物和半导体装置
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Application No.: US12203550Application Date: 2008-09-03
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Publication No.: US08148831B2Publication Date: 2012-04-03
- Inventor: Akihiro Horimoto , Yoshiyuki Goh
- Applicant: Akihiro Horimoto , Yoshiyuki Goh
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee: Sumitomo Bakelite Company, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JPP.2003-307700 20030829; JPP.2004-081581 20040319
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L63/00 ; B32B27/26 ; B32B27/38
Abstract:
The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.
Public/Granted literature
- US20090023840A1 LATENT CATALYST FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE Public/Granted day:2009-01-22
Information query
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