Invention Grant
- Patent Title: Circuit assembly including a power semiconductor module and a controller
- Patent Title (中): 电路组件包括功率半导体模块和控制器
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Application No.: US12570633Application Date: 2009-09-30
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Publication No.: US08148845B2Publication Date: 2012-04-03
- Inventor: Reinhold Bayerer
- Applicant: Reinhold Bayerer
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102008049673 20080930
- Main IPC: H05K1/00
- IPC: H05K1/00

Abstract:
A circuit assembly includes a power semiconductor module and, arranged externally thereto, a controller wherein the power semiconductor module comprises at least one controllable power semiconductor as well as at least one driver gating the latter, and controller and power semiconductor module each comprising a transceiver configured to communicate control signals between the controller and the power semiconductor module via an electromagnetic communication link unidirectionally or bidirectionally.
Public/Granted literature
- US20100084926A1 CIRCUIT ASSEMBLY INCLUDING A POWER SEMICONDUCTOR MODULE AND A CONTROLLER Public/Granted day:2010-04-08
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