Invention Grant
- Patent Title: Probe card electrically connectable with a semiconductor wafer
- Patent Title (中): 探针卡可与半导体晶圆电连接
-
Application No.: US12452716Application Date: 2008-07-16
-
Publication No.: US08149008B2Publication Date: 2012-04-03
- Inventor: Yoshio Yamada , Hiroshi Nakayama , Tsuyoshi Inuma , Takashi Akao
- Applicant: Yoshio Yamada , Hiroshi Nakayama , Tsuyoshi Inuma , Takashi Akao
- Applicant Address: JP Yokohama-shi
- Assignee: NHK Spring Co., Ltd.
- Current Assignee: NHK Spring Co., Ltd.
- Current Assignee Address: JP Yokohama-shi
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2007-188546 20070719
- International Application: PCT/JP2008/062849 WO 20080716
- International Announcement: WO2009/011365 WO 20090122
- Main IPC: G01R31/20
- IPC: G01R31/20

Abstract:
A probe card includes a probe head that holds a plurality of probes; a flat wiring board that has a wiring pattern corresponding to a circuit structure; an interposer that is stacked on the wiring board and relays wirings of the wiring board; a space transformer that is placed between the interposer and the probe head, transforms a space between the wirings relayed by the interposer, and leads the transformed wirings out to a surface facing the probe head; and a plurality of post members that are formed in a substantially columnar shape with a height larger than a sum of a thickness of the wiring board and a thickness of the interposer, and embedded to pierce through the wiring board and the interposer in a thickness direction such that one of end surfaces of each post member comes into contact with the space transformer.
Public/Granted literature
- US20100219852A1 PROBE CARD Public/Granted day:2010-09-02
Information query