Invention Grant
- Patent Title: Integrated circuit including inductive device and ferromagnetic material
- Patent Title (中): 集成电路包括电感器件和铁磁材料
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Application No.: US11860848Application Date: 2007-09-25
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Publication No.: US08149080B2Publication Date: 2012-04-03
- Inventor: Bernhard Knott , Josef Höglauer , Uwe Jansen
- Applicant: Bernhard Knott , Josef Höglauer , Uwe Jansen
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01L27/08
Abstract:
An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic material on a second side of the substrate opposite the first side.
Public/Granted literature
- US20090079529A1 INTEGRATED CIRCUIT INCLUDING INDUCTIVE DEVICE AND FERROMAGNETIC MATERIAL Public/Granted day:2009-03-26
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