Invention Grant
- Patent Title: Touchpad with single-layered printed circuit board structure
- Patent Title (中): 触摸板采用单层印刷电路板结构
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Application No.: US11274178Application Date: 2005-11-16
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Publication No.: US08149219B2Publication Date: 2012-04-03
- Inventor: Jia-Yih Lii , Yen-Chang Chiu , Yung-Lieh Chien
- Applicant: Jia-Yih Lii , Yen-Chang Chiu , Yung-Lieh Chien
- Applicant Address: TW Hsinchu
- Assignee: Elan Microelectronics Corporation
- Current Assignee: Elan Microelectronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Rosenberg, Klein & Lee
- Priority: TW94107545A 20050311
- Main IPC: G06F3/041
- IPC: G06F3/041
Abstract:
In a touchpad with single-layered PCB structure, a PCB has a bottom layer with a sensor area and a component area thereon, the sensor area includes two directional traces directly connected to the component area, respectively, and carbon film wires in the sensor area for interconnecting one or more of the directional traces.
Public/Granted literature
- US20060202970A1 Touchpad with single-layered printed circuit board structure Public/Granted day:2006-09-14
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