Invention Grant
- Patent Title: Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method
- Patent Title (中): 压接球直径检测装置和压力球直径检测方法
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Application No.: US12963874Application Date: 2010-12-09
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Publication No.: US08149276B2Publication Date: 2012-04-03
- Inventor: Kenji Sugawara , Yong Chen
- Applicant: Kenji Sugawara , Yong Chen
- Applicant Address: JP Tokyo
- Assignee: Shinkawa Ltd
- Current Assignee: Shinkawa Ltd
- Current Assignee Address: JP Tokyo
- Agency: Katten Muchin Rosenman LLP
- Priority: JP2008-154853 20080613
- Main IPC: H04N5/253
- IPC: H04N5/253

Abstract:
Improving detectability of a diameter of a pressure-bonded ball bonded by a bonding apparatus by calculating the diameter of the pressure-bonded ball by obtaining a first tentative radius by subtracting a distance between a line representing an outline of a pad short side and a curving line representing an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; obtaining a second tentative radius by subtracting a distance between a line representing an outline of a pad short side that faces toward the pad with which the first tentative radius is calculated and an outline of a pressure-bonded ball from a distance between the line representing the outline of the pad short side and a bonding-control-center position of the pressure-bonded ball; and averaging the same number of the first and the second tentative radii.
Public/Granted literature
- US20110128369A1 Pressure-Bonded Ball Diameter Detecting Apparatus and Pressure-Bonded Ball Diameter Detecting Method Public/Granted day:2011-06-02
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