Invention Grant
- Patent Title: Camera module and method of manufacturing the same
- Patent Title (中): 相机模块及其制造方法
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Application No.: US12081218Application Date: 2008-04-11
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Publication No.: US08149321B2Publication Date: 2012-04-03
- Inventor: Jin Mun Ryu , Jung Jin Kim , Bo Kyoung Kim , Jae Sub Cho
- Applicant: Jin Mun Ryu , Jung Jin Kim , Bo Kyoung Kim , Jae Sub Cho
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanincs Co., Ltd.
- Current Assignee: Samsung Electro-Mechanincs Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0035979 20070412
- Main IPC: H04N5/225
- IPC: H04N5/225

Abstract:
Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.
Public/Granted literature
- US20080252775A1 Camera module and method of manufacturing the same Public/Granted day:2008-10-16
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