Invention Grant
- Patent Title: Electronic device in which an electronic component is mounted on a main board
- Patent Title (中): 电子部件安装在主板上的电子装置
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Application No.: US12356732Application Date: 2009-01-21
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Publication No.: US08149340B2Publication Date: 2012-04-03
- Inventor: Young-ho Choi
- Applicant: Young-ho Choi
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2008-0072786 20080725
- Main IPC: H04N5/64
- IPC: H04N5/64

Abstract:
There is provided an electronic device. The electronic device includes: a main board formed with a cut out and comprising first and second surfaces facing each other; and an electronic component comprising a sub board and a casing and connected to the main board. A part of the electronic component is accommodated in the cut out of the main board across the first and second surfaces of the main board. The sub board and the main board are spaced from each other without overlap.
Public/Granted literature
- US20100020248A1 ELECTRONIC DEVICE IN WHICH AN ELECTRONIC COMPONENT IS MOUNTED ON A MAIN BOARD Public/Granted day:2010-01-28
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