Invention Grant
US08149383B2 Method for determining the systematic error in the measurement of positions of edges of structures on a substrate resulting from the substrate topology
有权
用于确定由衬底拓扑结果产生的衬底上的结构边缘的位置的测量中的系统误差的方法
- Patent Title: Method for determining the systematic error in the measurement of positions of edges of structures on a substrate resulting from the substrate topology
- Patent Title (中): 用于确定由衬底拓扑结果产生的衬底上的结构边缘的位置的测量中的系统误差的方法
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Application No.: US12219000Application Date: 2008-07-21
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Publication No.: US08149383B2Publication Date: 2012-04-03
- Inventor: Slawomir Czerkas
- Applicant: Slawomir Czerkas
- Applicant Address: DE Weilburg
- Assignee: Vistec Semiconductor Systems GmbH
- Current Assignee: Vistec Semiconductor Systems GmbH
- Current Assignee Address: DE Weilburg
- Agency: Davidson, Davidson & Kappel, LLC
- Priority: DE102007036815 20070803
- Main IPC: G03B27/42
- IPC: G03B27/42

Abstract:
A method for determining the lateral correction as a function of the substrate topology and/or the geometry of the substrate holder is disclosed. The substrate is placed on a measuring stage traversable in the X coordinate direction and Y coordinate direction, which carries the substrate to be measured. The substrate is supported on at least three support points which define a plane. An apparatus is provided for determining the position of a plurality of positions on the surface of the substrate in the in the X, Y and Z coordinate directions. The substrate is tiltable about an axis parallel to the X/Y plane, to enable the substrate to be measured in a tilted position.
Public/Granted literature
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