Invention Grant
- Patent Title: Capacitor module
- Patent Title (中): 电容器模块
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Application No.: US12226617Application Date: 2007-04-27
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Publication No.: US08149567B2Publication Date: 2012-04-03
- Inventor: Yoshitaka Niigaki , Hikosaburou Hiraki , Satoru Nishimuru
- Applicant: Yoshitaka Niigaki , Hikosaburou Hiraki , Satoru Nishimuru
- Applicant Address: JP Tokyo
- Assignee: Komatsu Ltd.
- Current Assignee: Komatsu Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Edwards Wildman Palmer LLP
- Priority: JP2006-123765 20060427
- International Application: PCT/JP2007/059248 WO 20070427
- International Announcement: WO2007/126082 WO 20071108
- Main IPC: H01G4/00
- IPC: H01G4/00

Abstract:
The capacitor module includes a capacitor, in which a screw hole is arranged on an outer bottom wall surface of a capacitor case housing a capacitor element, and a heat dissipater, on which a plurality of capacitor cases are fixated by screwing fixation screws in the screw holes of the capacitors. As a result, for example, the capacitor can be fixated with reliability and durability secured even under a condition where very strong vibration is continuously applied, for example, when the capacitor module is mounted on construction machinery. Further, because, an adherence of the outer bottom wall surface of the capacitor case on a fixation surface of the heat dissipater is strengthened by screwing the fixation screw in the screw hole, the capacitor can be cooled down by transferring heat produced by the capacitor to the heat dissipater as needed.
Public/Granted literature
- US20100060243A1 Capacitor Module Public/Granted day:2010-03-11
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