Invention Grant
- Patent Title: Detachable module system
- Patent Title (中): 可拆卸模块系统
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Application No.: US12260574Application Date: 2008-10-29
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Publication No.: US08149582B2Publication Date: 2012-04-03
- Inventor: Brian Philip Carlson , William Martin Christensen , Chris James Steep , Ryan Jacob Urban
- Applicant: Brian Philip Carlson , William Martin Christensen , Chris James Steep , Ryan Jacob Urban
- Applicant Address: US MN St. Paul
- Assignee: Ecolab Inc.
- Current Assignee: Ecolab Inc.
- Current Assignee Address: US MN St. Paul
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A detachable module system includes a plurality of modules that couple to a corresponding plurality of module mounts on a mounting plate. To install a selected module into the module system, a user translates the selected module to an engage position on its respective module mount to engage the selected module with a immediately preceding adjacent module. Any one of the modules may be identified and removed from its module mount, without requiring removal of the remaining modules. The modules may house various types of electronic devices.
Public/Granted literature
- US20100103629A1 DETACHABLE MODULE SYSTEM Public/Granted day:2010-04-29
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