Invention Grant
- Patent Title: Electronic component and electronic component module
- Patent Title (中): 电子元件和电子元件模块
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Application No.: US12410685Application Date: 2009-03-25
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Publication No.: US08149584B2Publication Date: 2012-04-03
- Inventor: Hitoshi Saita , Kenji Horino , Yasunobu Oikawa , Shinichiro Kakei
- Applicant: Hitoshi Saita , Kenji Horino , Yasunobu Oikawa , Shinichiro Kakei
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JPP2008-090335 20080331
- Main IPC: H05K1/18
- IPC: H05K1/18
Abstract:
In a dielectric element, the angle θ made by either the top face or the bottom face and the side faces is either 0°
Public/Granted literature
- US20090242256A1 ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE Public/Granted day:2009-10-01
Information query
