Invention Grant
- Patent Title: Mounting apparatus for expansion cards
- Patent Title (中): 扩充卡安装装置
-
Application No.: US13007969Application Date: 2011-01-17
-
Publication No.: US08149595B1Publication Date: 2012-04-03
- Inventor: Hung-Yi Wu , Xiao-Zhu Chen
- Applicant: Hung-Yi Wu , Xiao-Zhu Chen
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010589739 20101215
- Main IPC: H05K7/12
- IPC: H05K7/12 ; H05K7/14

Abstract:
A mounting apparatus includes a bracket, a first circuit board, a securing member, and a second circuit board. The bracket includes a first sidewall, and an end wall perpendicularly extending from a front end of the first sidewall, for fixing a stop plate of a first expansion card. The first circuit board is mounted to the first sidewall of the bracket adjacent to the end wall. A first expansion slot is installed on the first circuit board for engaging with the first expansion card. The securing member is detachably mounted to the first sidewall behind the first circuit board and away from the end wall, for fixing a stop plate of a second expansion card. The second circuit board is detachably mounted to the first sidewall adjacent to the securing member. A second expansion slot is installed on the second circuit board for engaging with the second expansion card.
Information query