Invention Grant
US08149906B2 Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed
有权
在具有增加的数据传输速度的多芯片半导体器件中的芯片之间的数据传输
- Patent Title: Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed
- Patent Title (中): 在具有增加的数据传输速度的多芯片半导体器件中的芯片之间的数据传输
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Application No.: US12323922Application Date: 2008-11-26
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Publication No.: US08149906B2Publication Date: 2012-04-03
- Inventor: Hideaki Saito , Hiroaki Ikeda
- Applicant: Hideaki Saito , Hiroaki Ikeda
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: NEC Corporation,Elpida Memory, Inc
- Current Assignee: NEC Corporation,Elpida Memory, Inc
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-310921 20071130
- Main IPC: H04B1/38
- IPC: H04B1/38

Abstract:
A data transfer method is disclosed in a multi-chip semiconductor device which comprises a plurality of inter-chip wires. First, a test is conducted to determine whether or not each inter-chip wire is capable of normally transferring data, on circuits arranged on chips between which the inter-chip wire is connected. When an inter-chip wire incapable of normally transferring data exists, the data transfer speed of the buffer circuit that is on the chip on the transmission and that is connected to an inter-chip wire capable of normally transferring data is increased. The buffer circuit, whose data transfer speed has been increased, transfers data which would otherwise be transferred through the inter-chip wire incapable of normally transferring data, together with the data which should be transferred thereby, to the chip on the reception side chip through an inter-chip wire connected to the buffer circuit at the data transfer speed.
Public/Granted literature
- US20090141827A1 DATA TRANSFER BETWEEN CHIPS IN A MULTI-CHIP SEMICONDUCTOR DEVICE WITH AN INCREASED DATA TRANSFER SPEED Public/Granted day:2009-06-04
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