Invention Grant
- Patent Title: Path redundant hardware efficient communications interconnect system
- Patent Title (中): 路径冗余硬件高效通信互联系统
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Application No.: US12672877Application Date: 2008-08-08
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Publication No.: US08150019B2Publication Date: 2012-04-03
- Inventor: Robert B. Smith
- Applicant: Robert B. Smith
- Agency: Santangelo Law Offices, P.C.
- International Application: PCT/US2008/072618 WO 20080808
- International Announcement: WO2009/023563 WO 20090219
- Main IPC: H04M3/00
- IPC: H04M3/00

Abstract:
A path redundant, hardware efficient communications interconnect (1) has embodiments that can present true any-to-any interconnect capability for first and second pathways (2) and (3) and can utilize double throw switches (25) with or without single throw switches (24) perhaps in staged collectives of sub arrays (4), (5), (6), (9), and (10). A loop-back communications interconnect (22) can be accomplished by an interleaved sub array (26). A quadrilateral center stage sub array (21) can be combined with asymmetric side stage sub arrays for hardware savings that are tenths of a percent of a traditional interconnect and even present eight fold savings over prior reduced hardware interconnects.
Public/Granted literature
- US20110123014A1 Path Redundant Hardware Efficient Communications Interconnect System Public/Granted day:2011-05-26
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