Invention Grant
- Patent Title: Headphone and ear pad
- Patent Title (中): 耳机和耳垫
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Application No.: US11983320Application Date: 2007-11-08
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Publication No.: US08150090B2Publication Date: 2012-04-03
- Inventor: Tomohiro Ito
- Applicant: Tomohiro Ito
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Frommer Lawrence & Haug LLP
- Agent William S. Frommer; Thomas F. Presson
- Priority: JPP2006-305627 20061110
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
The present invention provides a headphone with a more comfortable and stable feeling to the user when being worn by the user. The headphone includes a headphone section that has a sound-sending section of a speaker unit arranged at the front surface side thereof, and has its rear surface side covered by a housing, and an ear pad that covers the sound-sending section of the speaker unit. In the ear pad, a porous elastic body of low repulsion is covered by a pad cover.
Public/Granted literature
- US20080112586A1 Headphone and ear pad Public/Granted day:2008-05-15
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