Invention Grant
US08150668B2 Thermal fluid-structure interaction simulation in finite element analysis
有权
有限元分析中的热流体 - 结构相互作用模拟
- Patent Title: Thermal fluid-structure interaction simulation in finite element analysis
- Patent Title (中): 有限元分析中的热流体 - 结构相互作用模拟
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Application No.: US12369140Application Date: 2009-02-11
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Publication No.: US08150668B2Publication Date: 2012-04-03
- Inventor: Arthur B. Shapiro
- Applicant: Arthur B. Shapiro
- Applicant Address: US CA Livermore
- Assignee: Livermore Software Technology Corporation
- Current Assignee: Livermore Software Technology Corporation
- Current Assignee Address: US CA Livermore
- Agent Roger H. Chu
- Main IPC: G06F9/455
- IPC: G06F9/455

Abstract:
Simulation of thermal fluid-structure interaction using bulk flow fluid elements (BFFEs) is described. Each BFFE is configured to include the following characteristics: 1) at least one surrounding layer of solid elements representing either the surrounding structure or the pipe wall; 2) a layer of shell elements or Bulk Node Segments representing the outer boundary of the fluid; 3) a Bulk Node at the center of the BFFE for defining fluid properties (e.g., density, specific heat) and volume (i.e., fluid volume is calculated as the enclosed volume between the Bulk Node and all of the Bulk Node Segments that surround it); 4) a fluid flow beam element or Bulk Node Element for defining fluid flow path to another BFFE; and 5) a contact interface between the solid elements and the shell elements for conducting fluid-structure thermal interaction.
Public/Granted literature
- US20100204963A1 Thermal Fluid-Structure Interaction Simulation in Finite Element Analysis Public/Granted day:2010-08-12
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