Invention Grant
- Patent Title: Method for optimizing an integrated circuit physical layout
- Patent Title (中): 优化集成电路物理布局的方法
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Application No.: US12306340Application Date: 2007-06-27
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Publication No.: US08151234B2Publication Date: 2012-04-03
- Inventor: Martinus Maria Berkens , Simon Johannes Klaver
- Applicant: Martinus Maria Berkens , Simon Johannes Klaver
- Applicant Address: US CA Sunnyvale
- Assignee: Takumi Technology Corporation
- Current Assignee: Takumi Technology Corporation
- Current Assignee Address: US CA Sunnyvale
- Agency: Leydig, Voit & Mayer Ltd.
- Priority: EP06076308 20060627
- International Application: PCT/NL2007/050312 WO 20070627
- International Announcement: WO2008/002136 WO 20080103
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
The invention relates to a method of optimizing an integrated circuit layout, wherein an initial integrated circuit layout is provided. A predetermined set of physical characteristics of a predetermined set of polygons of said initial circuit layout, is assessed and said physical characteristics are aggregated to derive an integral quality number associated to said initial circuit layout. According to the invention, cost functions are generated to evaluate a perturbed quality number of said perturbed layout and layout perturbations are selected that optimize the quality number, so that the circuit layout is optimized.
Public/Granted literature
- US20100146465A1 Method for Optimizing and Integerated Circuit Physical Layout Public/Granted day:2010-06-10
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