Invention Grant
- Patent Title: Physical quantity sensor device and method of manufacturing the same
- Patent Title (中): 物理量传感器装置及其制造方法
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Application No.: US12802089Application Date: 2010-05-28
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Publication No.: US08151649B2Publication Date: 2012-04-10
- Inventor: Masashi Totokawa , Masao Naito , Akihiro Takeichi
- Applicant: Masashi Totokawa , Masao Naito , Akihiro Takeichi
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2009-132465 20090601
- Main IPC: G01L1/00
- IPC: G01L1/00 ; G01L1/22 ; H01C10/10 ; H01C11/00

Abstract:
A physical quantity sensor device (10) having a structure in which a stress-sensitive body (1) of which the electric characteristics vary depending upon the application of stress and an insulator (2) having electric insulation are formed being closely adhered together, wherein the stress-sensitive body (1) comprises a thin glass film containing an electrically conductive element that is solidly dissolved therein as atoms, a method of manufacturing the physical quantity sensor device, a piezo-resistive film comprising a thin glass film containing ruthenium that is solidly dissolved therein as atoms, and a method of manufacturing the piezo-resistive film.
Public/Granted literature
- US20100307255A1 Physical quantity sensor device and method of manufacturing the same Public/Granted day:2010-12-09
Information query