Invention Grant
- Patent Title: Layer cutting apparatus
- Patent Title (中): 层切割装置
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Application No.: US12870887Application Date: 2010-08-30
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Publication No.: US08151674B2Publication Date: 2012-04-10
- Inventor: James R. Baeten , Vanessa L. Little , Karalyn A. Littlefield , Mark W. Yungner , Robert A. Zoss , Linda Baggio
- Applicant: James R. Baeten , Vanessa L. Little , Karalyn A. Littlefield , Mark W. Yungner , Robert A. Zoss , Linda Baggio
- Applicant Address: US MN Minneapolis
- Assignee: General Mills Marketing, Inc.
- Current Assignee: General Mills Marketing, Inc.
- Current Assignee Address: US MN Minneapolis
- Agent John L. Crimmins; Alan Kamrath
- Main IPC: B26D1/547
- IPC: B26D1/547
Abstract:
A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall.
Public/Granted literature
- US20100319504A1 LAYER CUTTING APPARATUS Public/Granted day:2010-12-23
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