Invention Grant
- Patent Title: Blister package arrangement
- Patent Title (中): 吸塑包装布置
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Application No.: US10582736Application Date: 2004-12-14
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Publication No.: US08151990B2Publication Date: 2012-04-10
- Inventor: Simon Udo , Ernst-Rudolf Radtke
- Applicant: Simon Udo , Ernst-Rudolf Radtke
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: DE10360689 20031219
- International Application: PCT/DE2004/002740 WO 20041214
- International Announcement: WO2005/058723 WO 20050630
- Main IPC: B65D83/04
- IPC: B65D83/04

Abstract:
A blister package arrangement comprises a blister package (1) and a conductor carrier strip (10) attached thereto, wherein openings (4) of the carrier strip (10) are oriented toward pockets (3) of the blister package (1). When a tablet (2) is removed from a pocket (3), the sealing film (13) of the blister package (1) closing the pocket (3) is separated in such a way that the tablet (2) is removable through the opening (4) associated therewith. The openings (4) are formed by stamped cutting lines (41) which are disposed in the conductor carrier strip (10) and surround the pockets (3) of the associated areas in a ring shape. These stamped lines are interrupted by at least two spars or “bridge parts” (43) by means of which a cover (30), covering the pocket (3) and separated from the conductor carrier strip (10), is connected with the carrier strip.
Public/Granted literature
- US20070084746A1 Blister package arrangement Public/Granted day:2007-04-19
Information query
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