Invention Grant
- Patent Title: Recess filling apparatus
- Patent Title (中): 凹陷灌装设备
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Application No.: US13102810Application Date: 2011-05-06
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Publication No.: US08152039B2Publication Date: 2012-04-10
- Inventor: Roy Searle , Jan Holland
- Applicant: Roy Searle , Jan Holland
- Applicant Address: GB
- Assignee: Nail Seal Limited
- Current Assignee: Nail Seal Limited
- Current Assignee Address: GB
- Agency: Tumey L.L.P.
- Priority: GB0801563.8 20080129; GB0820409.1 20081107
- Main IPC: B25B23/04
- IPC: B25B23/04

Abstract:
A recess filling apparatus forms part of, or is for use with, a tool for driving a multiplicity of fixing elements into a work surface. The apparatus utilizes a dispensing strip defining a multiplicity of chambers containing filler material, each chamber containing sufficient filler material for use with a single fixing element. The apparatus comprises means to support the dispensing strip, and means for locating a chamber that contains filler material in or adjacent to the path of a fixing element, and for advancing the dispensing strip prior to driving the next fixing element.
Public/Granted literature
- US20110259474A1 Recess Filling Apparatus Public/Granted day:2011-10-27
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