The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.