A socket contact that makes contact with a lead pin is provided on a mating electronic component, wherein this socket contact comprises a retention section that is press-fit in a contact cavity provided in a housing, a base section that extends downward from this retention section, and a pair of resilient contact pieces that extend from either side edge of this base section in mutually facing directions. The paired resilient contact pieces respectively comprise end sections that extend backward from the side edges of the base section, and lead pin contact sections that extend upward and forward at an inclination from the rear ends of the base section and that are also formed with an inclination so as to approach each other toward the tip ends thereof, and after the lead pin is inserted into the contact cavity toward the rear ends of the base end parts, the lead pin moves forward so as to contact the lead pin contact section in a position to the rear side of the retention section.