Invention Grant
- Patent Title: Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the same
- Patent Title (中): 制造导电性粒子的方法,具有该导电粒子的各向异性导电粘合剂及其制造方法
-
Application No.: US12207138Application Date: 2008-09-09
-
Publication No.: US08153030B2Publication Date: 2012-04-10
- Inventor: Min-Sok Jang , Kyung-Hwan Ko , Seung-Il Lee , Jin-Wook Moon , Jeong-Geun Han
- Applicant: Min-Sok Jang , Kyung-Hwan Ko , Seung-Il Lee , Jin-Wook Moon , Jeong-Geun Han
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2007-0092218 20070911
- Main IPC: H01B1/22
- IPC: H01B1/22

Abstract:
In an anisotropic conductive adhesive containing a conductive particle, the conductive particle includes a resin particle that is provided with a cavity formed therein and a conductive layer surrounding a surface of the resin particle. The cavity is formed by mixing the resin particle with a reactant and partially removing the reactant from the resin particle. Thus, the conductive particle may readily absorb an external pressure, thereby providing an improved malleability to the conductive particle.
Public/Granted literature
Information query