Invention Grant
- Patent Title: Image sensing devices and methods for fabricating the same
- Patent Title (中): 图像感测装置及其制造方法
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Application No.: US12407115Application Date: 2009-03-19
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Publication No.: US08153458B2Publication Date: 2012-04-10
- Inventor: Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
- Applicant: Jui-Ping Weng , Tzu-Han Lin , Pai-Chun Peter Zung
- Applicant Address: TW Hsinchu
- Assignee: Visera Technologies Company Limited
- Current Assignee: Visera Technologies Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Thomas|Kayden
- Main IPC: H01L21/70
- IPC: H01L21/70 ; H01L31/0232 ; H01L31/14
Abstract:
Image sensing devices and methods for fabricating the same are provided. An exemplary image sensing device comprises a first substrate having a first side and a second side opposing each other. A plurality of image sensing elements is formed in the first substrate at the first side. A conductive via is formed through the first substrate, having a first surface exposed by the first substrate at the first side and a second surface exposed by the first substrate at the second side. A conductive pad overlies the conductive via at the first side and is electrically connecting the image sensing elements. A conductive layer overlies the conductive via at the second side and electrically connects with the conductive pad. A conductive bump is formed over a portion of the conductive layer. A second substrate is bonded with the first substrate at the first side.
Public/Granted literature
- US20090181490A1 IMAGE SENSING DEVICES AND METHODS FOR FABRICATING THE SAME Public/Granted day:2009-07-16
Information query
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