Surface mount optoelectronic component with lens having protruding structure

Invention Grant

US08153460B2 Surface mount optoelectronic component with lens having protruding structure 有权

Title translation: 具有突出结构的透镜的表面贴装光电元件

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Patent Title: Surface mount optoelectronic component with lens having protruding structure
Patent Title (中): 具有突出结构的透镜的表面贴装光电元件
Application No.: US13008999

Application Date: 2011-01-19
Publication No.: US08153460B2

Publication Date: 2012-04-10
Inventor: Tek Beng Low , Kheng Chiong Tay
Applicant: Tek Beng Low , Kheng Chiong Tay
Agency: Finnegan, Henderson, Farabow, Garrett & Dunner LLP
Priority: MYPI20054103 20050901
Main IPC: H01L21/00
IPC: H01L21/00

Surface mount optoelectronic component with lens having protruding structure

Abstract:

The invention relates to a surface mount optoelectronic component with a lens attachment, the method for precising the lens position and the method to manufacture the whole component.

Abstract(Chinese):

本发明涉及具有透镜附件的表面贴装光电元件，用于确定透镜位置的方法和制造整个元件的方法。

Public/Granted literature

US20110156296A1 Surface Mount Optoelectronic Component with Lens Having Protruding Structure Public/Granted day:2011-06-30

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备