Invention Grant
- Patent Title: Electronic component and method of manufacturing the same
- Patent Title (中): 电子部件及其制造方法
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Application No.: US13040793Application Date: 2011-03-04
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Publication No.: US08153476B2Publication Date: 2012-04-10
- Inventor: Yasufumi Kaneda , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
- Applicant: Yasufumi Kaneda , Akira Moriya , Kaoru Sakinada , Shunichi Aikawa , Yoshinori Kondou , Takashi Yamashita
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2008-44818 20080226
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/30
Abstract:
An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge.
Public/Granted literature
- US20110156265A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-06-30
Information query
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