Invention Grant
US08153762B2 Composition for palladium-mediated cleavage of peptides containing CXC, CXH or CHM sequences
有权
用于钯介导的切割含有CXC,CXH或CHM序列的肽的组合物
- Patent Title: Composition for palladium-mediated cleavage of peptides containing CXC, CXH or CHM sequences
- Patent Title (中): 用于钯介导的切割含有CXC,CXH或CHM序列的肽的组合物
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Application No.: US12199902Application Date: 2008-08-28
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Publication No.: US08153762B2Publication Date: 2012-04-10
- Inventor: Barton Holmquist , Daniel J. Strydom , Jin Seog Seo
- Applicant: Barton Holmquist , Daniel J. Strydom , Jin Seog Seo
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Mueting, Raasch & Gebhardt PA
- Main IPC: C07K1/107
- IPC: C07K1/107

Abstract:
The invention provides a process for amidating a desired peptide comprising cleaving a substrate polypeptide at a X1-cysteine sequence, wherein X1 is the amino acid at the peptide carboxyl-terminus and cysteine is the first amino acid of a palladium cleavage site comprising the sequence cysteine-X2-X3, wherein X2 is any amino acid, X3 is an amino acid selected from the group consisting of cysteine, histidine, or methionine, and wherein the carboxyl-terminus of the peptide is amidated upon cleavage at the X1-cysteine sequence.
Public/Granted literature
- US20090215987A1 PEPTIDE AMIDATION PROCESS Public/Granted day:2009-08-27
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