Invention Grant
- Patent Title: Substrate panel including insulation parts and bus line
- Patent Title (中): 基板包括绝缘零件和总线
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Application No.: US12213701Application Date: 2008-06-23
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Publication No.: US08153904B2Publication Date: 2012-04-10
- Inventor: Hee-Soo Yoon , Chang-Hwan Choi , Soo-Heung Lee , Jong-Soo Yoo , Dal-Hyun Yoo , Ji-Chul An , Jeong-Hoon Park
- Applicant: Hee-Soo Yoon , Chang-Hwan Choi , Soo-Heung Lee , Jong-Soo Yoo , Dal-Hyun Yoo , Ji-Chul An , Jeong-Hoon Park
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0123935 20071130
- Main IPC: H05K1/00
- IPC: H05K1/00 ; C25D5/16

Abstract:
A substrate panel is disclosed. The substrate panel may include a clamp contact, a bus line formed at a distance from the clamp contact, and a plurality of substrate units supplied with an electric current by way of the bus line, where an insulation part may be formed between the clamp contact and the bus line, through which electricity may not flow.
Public/Granted literature
- US20090139746A1 Substrate panel Public/Granted day:2009-06-04
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