Invention Grant
- Patent Title: Electromagnetic bandgap structure and printed circuit board
- Patent Title (中): 电磁带隙结构和印刷电路板
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Application No.: US12010437Application Date: 2008-01-24
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Publication No.: US08153907B2Publication Date: 2012-04-10
- Inventor: Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
- Applicant: Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0041993 20070430
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
Public/Granted literature
- US20080264685A1 Electromagnetic bandgap structure and printed circuit board Public/Granted day:2008-10-30
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