Invention Grant
- Patent Title: LED device and method of packaging the same
- Patent Title (中): LED装置和包装方法相同
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Application No.: US12648306Application Date: 2009-12-29
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Publication No.: US08154033B2Publication Date: 2012-04-10
- Inventor: Yu-Huan Liu
- Applicant: Yu-Huan Liu
- Applicant Address: TW Shulin Dist., New Taipei
- Assignee: Everlight Electronics Co., Ltd.
- Current Assignee: Everlight Electronics Co., Ltd.
- Current Assignee Address: TW Shulin Dist., New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW97151186A 20081229
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent substrate, and utilized for radiating at least a light beam. The circuit is disposed on the transparent substrate and electrically connected to the LED chips. The transparent encapsulant is utilized for packaging the LED chips. The light beam of the LED chips can propagate from two opposite sides of the transparent substrate. Blue LED chips and the circuit of the transparent substrate can be directly soldered, and the phosphors are arranged to convert the wavelength of blue light, so a dual-side white light emitting device can therefore be provided.
Public/Granted literature
- US20100163892A1 LED DEVICE AND METHOD OF PACKAGING THE SAME Public/Granted day:2010-07-01
Information query
IPC分类: