Invention Grant
- Patent Title: Nitride semiconductor device
- Patent Title (中): 氮化物半导体器件
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Application No.: US12223784Application Date: 2007-02-08
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Publication No.: US08154036B2Publication Date: 2012-04-10
- Inventor: Ken Nakahara
- Applicant: Ken Nakahara
- Applicant Address: JP
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP
- Agency: Rabin & Berdo, PC
- Priority: JP2006-032993 20060209
- International Application: PCT/JP2007/052264 WO 20070208
- International Announcement: WO2007/091651 WO 20070816
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A nitride semiconductor device according to the present invention sequentially includes at least an n-electrode, an n-type semiconductor layer, an active layer, and a p-type semiconductor layer. The n-type semiconductor layer includes: an n-type GaN contact layer including n-type impurity-doped GaN having an electron concentration ranging from 5×1016 cm−3 to 5×1018 cm−3; the n-electrode provided on one of a main surface of the n-type GaN contact layer; and a generating layer provided on other main surface of the n-type GaN contact layer, including at least any one of AlxGa1-xN (0
Public/Granted literature
- US20090057695A1 Nitride Semiconductor Device Public/Granted day:2009-03-05
Information query
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