Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US13019662Application Date: 2011-02-02
-
Publication No.: US08154077B2Publication Date: 2012-04-10
- Inventor: Toshitaka Miyata
- Applicant: Toshitaka Miyata
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Turocy & Watson, LLP
- Priority: JPP2010-021074 20100202
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L23/62

Abstract:
According to an embodiment, a semiconductor device includes a gate electrode formed on a semiconductor substrate via an insulating layer; a source region including an extension region, a drain region including an extension region, a first diffusion restraining layer configured to prevent a diffusion of the conductive impurity in the source region and including an impurity other than the conductive impurity, and a second diffusion restraining layer configured to prevent a diffusion of the impurity in the drain region and including the impurity other than the conductive impurity.
Public/Granted literature
- US20110186925A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-08-04
Information query
IPC分类: