Invention Grant
- Patent Title: Multi-component strain-inducing semiconductor regions
- Patent Title (中): 多组分应变诱导半导体区域
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Application No.: US13107739Application Date: 2011-05-13
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Publication No.: US08154087B2Publication Date: 2012-04-10
- Inventor: Ted E. Cook, Jr. , Bernhard Sell , Anand Murthy
- Applicant: Ted E. Cook, Jr. , Bernhard Sell , Anand Murthy
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
A multi-component strain-inducing semiconductor region is described. In an embodiment, formation of such a strain-inducing semiconductor region laterally adjacent to a crystalline substrate results in a uniaxial strain imparted to the crystalline substrate, providing a strained crystalline substrate. In one embodiment, the multi-component strain-inducing material region comprises a first portion and a second portion which are separated by an interface. In a specific embodiment, the concentration of charge-carrier dopant impurity atoms of the two portions are different from one another at the interface.
Public/Granted literature
- US20110215375A1 MULTI-COMPONENT STRAIN-INDUCING SEMICONDUCTOR REGIONS Public/Granted day:2011-09-08
Information query
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