Invention Grant
- Patent Title: High voltage diode with reduced substrate injection
-
Application No.: US12537318Application Date: 2009-08-07
-
Publication No.: US08154101B2Publication Date: 2012-04-10
- Inventor: Sameer P. Pendharkar , Binghua Hu
- Applicant: Sameer P. Pendharkar , Binghua Hu
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L29/861
- IPC: H01L29/861

Abstract:
A high voltage diode in which the n-type cathode is surrounded by an uncontacted heavily doped n-type ring to reflect injected holes back into the cathode region for recombination or collection is disclosed. The dopant density in the heavily doped n-type ring is preferably 100 to 10,000 times the dopant density in the cathode. The heavily doped n-type region will typically connect to an n-type buried layer under the cathode. The heavily doped n-type ring is optimally positioned at least one hole diffusion length from cathode contacts. The disclosed high voltage diode may be integrated into an integrated circuit without adding process steps.
Public/Granted literature
- US20100032794A1 HIGH VOLTAGE DIODE WITH REDUCED SUBSTRATE INJECTION Public/Granted day:2010-02-11
Information query
IPC分类: