Invention Grant
- Patent Title: Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
- Patent Title (中): 适用于晶圆级三维（3D）集成和制造方法的弹簧插入器
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Application No.: US12751980Application Date: 2010-03-31
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Publication No.: US08154119B2Publication Date: 2012-04-10
- Inventor: Sang Won Yoon , Koji Shiozaki
- Applicant: Sang Won Yoon , Koji Shiozaki
- Applicant Address: US KY Erlanger
- Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
- Current Assignee Address: US KY Erlanger
- Agency: Snell & Wilmer LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/12
Abstract:
The present invention is an apparatus for integrating multiple devices. The apparatus includes a substrate having a first via and a second via, a semiconductor chip positioned on a top portion of the substrate and positioned between the first via and the second via, first and second bumps positioned on the semiconductor chip, and an interposer wafer having a first interposer spring assembly and a second interposer spring assembly, the first interposer spring assembly having a first interposer spring and a first electrical connection attached to the first interposer spring, and the second interposer spring assembly having a second interposer spring and a second electrical connection attached to the second interposer spring.
Public/Granted literature
Information query
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