Invention Grant
- Patent Title: Piezoelectric frame surrounding a piezoelectric vibrating piece and package with exhaust channel
- Patent Title (中): 压电框架围绕压电振动片和封装带排气通道
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Application No.: US12510085Application Date: 2009-07-27
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Publication No.: US08154178B2Publication Date: 2012-04-10
- Inventor: Ryoichi Ichikawa , Mitoshi Umeki
- Applicant: Ryoichi Ichikawa , Mitoshi Umeki
- Applicant Address: JP Tokyo
- Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee: Nihon Dempa Kogyo Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Klarquist Sparkman, LLP
- Priority: JP2008-206881 20080811
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
In the disclosed piezoelectric devices a piezoelectric frame includes a vibrating piece. An excitation electrode is formed on the vibrating piece. An outer frame portion surrounds the vibrating piece and includes an extraction electrode connected to the excitation electrode. A package base is bonded to one surface of the outer frame portion and includes a connection electrode connected to the extraction electrode. The package base includes an external terminal formed on a surface thereof opposite the surface on which the connection electrodes are formed. Through-hole conductors connected the connection electrodes with respective external terminals. A lid is bonded to an opposing surface of the piezoelectric frame. An exhaust channel is in communication with the extraction electrode adjacent the through-hole conductors.
Public/Granted literature
- US20100033061A1 PIEZOELECTRIC DEVICES Public/Granted day:2010-02-11
Information query
IPC分类: