Invention Grant
US08154277B2 Method and apparatus for measuring the thickness of a metal layer provided on a metal object
有权
用于测量设置在金属物体上的金属层的厚度的方法和装置
- Patent Title: Method and apparatus for measuring the thickness of a metal layer provided on a metal object
- Patent Title (中): 用于测量设置在金属物体上的金属层的厚度的方法和装置
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Application No.: US13235142Application Date: 2011-09-16
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Publication No.: US08154277B2Publication Date: 2012-04-10
- Inventor: Sten Linder , Lennart Thegel
- Applicant: Sten Linder , Lennart Thegel
- Applicant Address: SE
- Assignee: ABB AB
- Current Assignee: ABB AB
- Current Assignee Address: SE
- Agency: St. Onge Steward Johnston & Reens LLC
- Main IPC: G01B7/06
- IPC: G01B7/06

Abstract:
A method and an apparatus for measuring the thickness of a metal layer. The metal layer has a resistivity (ρ1) that differs from the resistivity (ρ2) of the metal object. The apparatus includes a first device arranged to generate a magnetic field in close vicinity of the metal layer, and to generate a variation of the magnetic field so that a current is induced in the surface of the metal layer, a second device arranged to measure the changes of the magnetic field outside the metal layer due to the induced current during a time period that is longer than the time it takes for the current to propagate through the metal layer, and a computing unit to determine the thickness of the layer based on a mathematical relation between the thickness of the layer and the measured values of the changes of the magnetic field.
Public/Granted literature
- US20120001624A1 Method And Apparatus For Measuring The Thickness Of A Metal Layer Provided On A Metal Object Public/Granted day:2012-01-05
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