Invention Grant
- Patent Title: Apparatus and method for current sensing using a wire bond
- Patent Title (中): 使用引线键进行电流检测的装置和方法
-
Application No.: US12792764Application Date: 2010-06-03
-
Publication No.: US08154345B2Publication Date: 2012-04-10
- Inventor: Paul R. Andrys , David S. Ripley , Terry J. Shie
- Applicant: Paul R. Andrys , David S. Ripley , Terry J. Shie
- Applicant Address: US CA Irvine
- Assignee: Skyworks Solutions, Inc.
- Current Assignee: Skyworks Solutions, Inc.
- Current Assignee Address: US CA Irvine
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: H03F1/52
- IPC: H03F1/52

Abstract:
An apparatus for sensing power amplifier current includes a system voltage source that is used to develop a reference voltage, a wire bond structure connected between the system voltage source and a power amplifier, where a sense voltage developed across the wire bond structure is indicative of a current flowing through the power amplifier, and a current source configured to compensate the reference voltage for changes in resistance of the wire bond structure due to a temperature coefficient of the wire bond structure.
Public/Granted literature
- US20110298538A1 APPARATUS AND METHOD FOR CURRENT SENSING USING A WIRE BOND Public/Granted day:2011-12-08
Information query