Invention Grant
- Patent Title: Resin multilayer device and method for manufacturing same
- Patent Title (中): 树脂多层器件及其制造方法
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Application No.: US13102710Application Date: 2011-05-06
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Publication No.: US08154360B2Publication Date: 2012-04-10
- Inventor: Yusuke Uemichi , Takuya Aizawa , Osamu Nakao
- Applicant: Yusuke Uemichi , Takuya Aizawa , Osamu Nakao
- Applicant Address: JP Tokyo
- Assignee: Fujikura Ltd.
- Current Assignee: Fujikura Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2008-292687 20081114
- Main IPC: H03H7/42
- IPC: H03H7/42 ; H01P3/08
Abstract:
Provided is a resin multilayer device having a balun, wherein the resin multilayer device comprises: a substrate; a first resin layer formed on the substrate; two balanced signal transmission lines that are electrically independently disposed on the first resin layer; a second resin layer formed on the two balanced signal transmission lines and the first resin layer; an unbalanced signal transmission line disposed on the second resin layer and facing the two balanced signal transmission lines; and a third resin layer formed on the unbalanced signal transmission line and the second resin layer.
Public/Granted literature
- US20110210804A1 RESIN MULTILAYER DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2011-09-01
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