Invention Grant
US08154575B2 Heating resistor element, manufacturing method for the same, thermal head, and printer
有权
加热电阻元件,制造方法相同,热敏头和打印机
- Patent Title: Heating resistor element, manufacturing method for the same, thermal head, and printer
- Patent Title (中): 加热电阻元件,制造方法相同,热敏头和打印机
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Application No.: US12254570Application Date: 2008-10-20
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Publication No.: US08154575B2Publication Date: 2012-04-10
- Inventor: Keitaro Koroishi , Toshimitsu Morooka , Noriyoshi Shoji , Yoshinori Sato , Norimitsu Sanbongi
- Applicant: Keitaro Koroishi , Toshimitsu Morooka , Noriyoshi Shoji , Yoshinori Sato , Norimitsu Sanbongi
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2007-275604 20071023; JP2008-218637 20080827
- Main IPC: B41J2/335
- IPC: B41J2/335

Abstract:
Provided is a heating resistor element, including: an insulating substrate (9); a heat accumulating layer (10) bonded to a surface of the insulating substrate (9); and a heating resistor (11) provided on the heat accumulating layer (10), in which: on at least one of bonded surfaces between the heating substrate (9) and the heat accumulating layer (10), at least one of the insulating substrate (9) and the heat accumulating layer (10) is provided with a concave portion (16) in a region opposed to the heating resistor (11) to form a hollow portion (17); and the concave portion (16) has a curvature radius of 10 μm or more at each corner thereof. Accordingly, occurrence of stress concentration caused by heat or a load can be suppressed to improve durability, and both a sufficient strength and heating efficiency are realized.
Public/Granted literature
- US20090102912A1 HEATING RESISTOR ELEMENT, MANUFACTURING METHOD FOR THE SAME, THERMAL HEAD, AND PRINTER Public/Granted day:2009-04-23
Information query
IPC分类: